Q‑Silver 5F – 16 x 500 mm, ø2 mm

A filler metal designed for copper brazing. The alloy has deoxidising properties, thus perfectly wets copper surface without the use of flux. As a result, the joint does not require cleaning. The silver content (5 %) facilitates soldering and improves joint performance. Q-Silver 5F filler metal is used in capillary soldering of copper plumbing (e.g. heating, solar installations), as well as in refrigeration and air conditioning. Offered in an original pack containing 16 rods with length of 500 mm and 2 mm diameter.

Strong joints due to capillary action. As a result of excellent wetting and high fluidity, Q-Silver 5F thoroughly fills joint clearances. If the clearance gap has the right width, capillary forces exceed the force of gravity and pull the binder into the gap, no matter how the component is positioned. This results in high strength and tight joints. The microphotograph shows a cross-section of a joint brazed with Q-Silver 5F.

Alloy characteristics

Q-Silver 5F is a copper-phosphorus alloy with silver designed for copper brazing. The addition of silver (5 %) lowers the melting point, which facilitates soldering. Silver also improves the strength parameters of the joint by increasing ductility, and lowers the thermal and electrical conductivity of the joint. Due to phosphorus content, the alloy is deoxidising and the flux is not need when brazing copper. The corrosion resistance is comparable to copper. However, the alloy should not be used for joints exposed to sulphur compounds. These cause cumulative corrosion and, even in low concentrations, can damage the joint. Accelerated corrosion can also be caused by pressured steam.

Właściwości: Solidification point (Solidus): 643 °C Flow point: 718 °C Melting point (Liquidus): 813 °C Brazing Temperature: 718 °C – 815 °C

The photos below show components brazed with Q-Silver 5F.

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