Professional lead-free Sn99.3Cu0.7 flux-cored soldering ø1 mm wire. Compliant with PN EN 29453:2000 and RoHS 2002/95/EC Directive. It is an inexpensive substitute for tin-lead solders. The high quality of the product is ensured by the absence of air during melting. The vial contains 14 g of binder.

Alloy composition:

tin: 99,3 ± 0,2%,
copper: reminder.
Purity of ingredients minimum 99,90%.

Parameters:

melting point: 227 °C,
soldering temperature: 300 do 400°C,
specific gravity: 7,3 g/cm3.

Lead-free core flux wire for soldering electronic circuits.

Flux
The flux used in the solder is of the “No Clean” type (1.1.3 to EN 29454, SW 32 to DIN 8511). It is a rosin flux modified with organic activators. It contains no halogens. Soldering residues do not need to be washed off.