Professional lead-free Sn99.3Cu0.7 flux-cored soldering ø1 mm wire. Compliant with PN EN 29453:2000 and RoHS 2002/95/EC Directive. It is an inexpensive substitute for tin-lead solders. The high quality of the product is ensured by the absence of air during melting. The vial contains 14 g of binder.

Alloy composition: tin: 99,3 ± 0,2%, copper: reminder. Purity of ingredients minimum 99,90%. Parameters: melting point: 227 °C, soldering temperature: 300 do 400°C, specific gravity: 7,3 g/cm3.

Flux
The flux used in the solder is of the “No Clean” type (1.1.3 to EN 29454, SW 32 to DIN 8511). It is a rosin flux modified with organic activators. It contains no halogens. Soldering residues do not need to be washed off.

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